Guhitamo Icyuma Cyiza Cyiza: Inkomoko yohereza ibyuka Semiconductor Laser Igice cya kabiri

Guhitamo ByizaInkomoko: Imyuka yoherezwaSemiconductor LaserIgice cya kabiri

4. Gusaba imiterere ya edge-emission semiconductor laseri
Kubera uburebure bwagutse bwumurambararo nimbaraga nini cyane, ibyuma bisohora ibyuma bisohora ibyuma byakoreshejwe neza mubice byinshi nkimodoka, itumanaho ryiza nalaserkwivuza. Nk’uko bitangazwa na Yole Developpement, ikigo cy’ubushakashatsi ku isoko kizwi ku rwego mpuzamahanga, ngo isoko rya laser rizajya ryiyongera rizagera kuri miliyari 7.4 z'amadolari mu 2027, aho izamuka ry’umwaka ryiyongereyeho 13%. Iri terambere rizakomeza gutwarwa n’itumanaho rya optique, nka modul optique, amplifier, hamwe na 3D sensing ya porogaramu yo gutumanaho amakuru n’itumanaho. Kubisabwa bitandukanye byo gusaba, gahunda zitandukanye za EEL zubatswe zateguwe mubikorwa byinganda, harimo: Fabripero (FP) ibyuma byifashishwa bya semiconductor, Ikwirakwizwa rya Bragg Reflector (DBR) ya semiconductor laseri, lazeri yo hanze ya cavity laser (ECL), ikwirakwiza ibitekerezo bya semiconductor (Laser), kwant cascade semiconductor laseri (QCL), hamwe na diode yagutse (BALD).

Hamwe nogukenera gukenera itumanaho ryiza, porogaramu ya 3D sensing hamwe nizindi nzego, icyifuzo cya lazeri ya semiconductor nacyo kiriyongera. Mubyongeyeho, ibyuma bisohora ibyuma bisohora ibyuma hamwe na vertical-cavity surface-isohora semiconductor laseri nayo igira uruhare mukuzuza ibitagenda neza muburyo bukoreshwa, nka:
. AlGaAs yiganje.
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5. Iterambere ry'ejo hazaza
Impande zisohora lazeri ya semiconductor ifite ibyiza byo kwizerwa cyane, miniaturizasi hamwe nubucucike bukabije bwumuriro, kandi ifite ibyifuzo byinshi mugutumanaho neza, liDAR, ubuvuzi nizindi nzego. Nubwo, nubwo uburyo bwo gukora ibyuma bisohora ibyuma byifashishwa byifashishwa byifashishwa mu rwego rwo hejuru, kugira ngo byuzuze ibisabwa ku masoko y’inganda n’abaguzi ku masoko y’icyuma gisohora ibyuma, birakenewe guhora tunonosora ikoranabuhanga, inzira, imikorere n’ibindi bice byifashishwa mu gusohora ibyuma byangiza, harimo: kugabanya ubucucike bw’inenge imbere ya wafer; Kugabanya inzira zikorwa; Gutezimbere tekinolojiya mishya yo gusimbuza uruziga rwa gakondo hamwe no gukata ibyuma bya wafer bikunda kumenyekanisha inenge; Hindura epitaxial structure kugirango utezimbere imikorere ya laser yohereza; Mugabanye ibiciro byo gukora, nibindi. Byongeye kandi, kubera ko urumuri rusohoka rwa lazeri rusohora impande zombi kuruhande rwa semiconductor laser chip, biragoye kugera kubipaki ntoya, bityo rero inzira yo gupakira iracyakeneye gukomeza gucika.