Iterambere n'iterambere ry'ikoranabuhanga rya CPO optoelectronic co-packaging Igice cya kabiri

Iterambere n'iterambere ry'umuyobozi mukuru w'imarioptoelectronicikoranabuhanga ryo gupakira hamwe

Gupakira hamwe ibikoresho bya optoelectronic si ikoranabuhanga rishya, iterambere ryaryo rishobora gukurikirwa no mu myaka ya za 1960, ariko muri iki gihe, gupakira hamwe ibikoresho bya photoelectric ni ipaki yoroshye gusa.ibikoresho by'ikoranabuhangahamwe. Mu myaka ya 1990, ubwo havukagamodule y'itumanaho rya optiqueInganda, gupakira ibikoresho by’amashanyarazi hakoreshejwe ikoranabuhanga byatangiye kugaragara. Kubera ko ingufu nyinshi za mudasobwa zazamutse cyane ndetse n’ubukene bwinshi bw’umuyoboro w’amashanyarazi muri uyu mwaka, gupakira ibikoresho by’amashanyarazi hakoreshejwe ikoranabuhanga, hamwe n’ikoranabuhanga rijyanye nabyo, byongeye kwitabwaho cyane.
Mu iterambere ry'ikoranabuhanga, buri cyiciro gifite imiterere itandukanye, kuva kuri 2.5D CPO ijyanye n'ubusabe bwa 20/50Tb/s, kugeza kuri 2.5D Chiplet CPO ijyanye n'ubusabe bwa 50/100Tb/s, hanyuma amaherezo igera kuri 3D CPO ijyanye n'igipimo cya 100Tb/s.

CPO ya 2.5D ipakiyemodule y'izubana chip ya network switch kuri substrate imwe kugira ngo igabanye intera y'umurongo no kongera ubucucike bwa I/O, kandi 3D CPO ihuza neza IC y'urumuri n'urwego rw'intermediary kugira ngo ihuze pitch ya I/O iri munsi ya 50um. Intego y'iterambere ryayo irasobanutse neza, ariyo kugabanya intera iri hagati ya module ya photoelectric conversion na chip ya network switching uko bishoboka kose.
Kugeza ubu, CPO iracyari ntoya, kandi haracyari ibibazo nko kubona umusaruro muke no gukoresha amafaranga menshi mu kubungabunga, kandi abakora ibikoresho bake ku isoko bashobora gutanga ibicuruzwa bifitanye isano na CPO ku buryo bwuzuye. Broadcom, Marvell, Intel, n'abandi bake gusa ni bo bafite ibisubizo byihariye ku isoko.
Marvell yatangije uburyo bwa 2.5D CPO switch hakoreshejwe uburyo bwa VIA-LAST umwaka ushize. Nyuma y'uko chip ya silicon optique itunganyijwe, TSV itunganywa ifite ubushobozi bwo gutunganya bwa OSAT, hanyuma chip ya electrical chip flip-chip yongerwa kuri chip ya silicon optique. Module 16 za optique na chip ya switching Marvell Teralynx7 bihujwe kuri PCB kugira ngo bikore switch, ishobora kugera ku gipimo cyo guhindura cya 12.8Tbps.

Muri OFC y'uyu mwaka, Broadcom na Marvell bagaragaje kandi ikoranabuhanga rigezweho rya switch chips za 51.2Tbps hakoreshejwe ikoranabuhanga rya optoelectronic co-packaging.
Kuva ku gisekuruza gishya cya Broadcom cy’amakuru arambuye kuri tekiniki ya CPO, paki ya CPO 3D binyuze mu kunoza inzira kugira ngo habeho ubucucike bwa I/O buri hejuru, ikoreshwa ry’ingufu za CPO rigera kuri 5.5W/800G, igipimo cyo gukoresha ingufu neza ni cyiza cyane. Muri icyo gihe, Broadcom nayo irimo kugera ku muraba umwe wa 200Gbps na 102.4T CPO.
Cisco kandi yongereye ishoramari ryayo mu ikoranabuhanga rya CPO, inagaragaza ibicuruzwa bya CPO muri OFC y'uyu mwaka, igaragaza ikoranabuhanga ryayo rya CPO rikusanyirijwe hamwe n'ikoreshwa ryayo kuri multiplexer/demultiplexer ihuriweho cyane. Cisco yavuze ko izakora igerageza ryo gushyiraho CPO mu buryo bwa 51.2Tb switches, hanyuma hagakurikiraho gukoresha CPO mu buryo bunini mu buryo bwa 102.4Tb switches.
Intel imaze igihe kinini itangije uburyo bwa CPO bwo gusimbuza amakuru, kandi mu myaka ya vuba aha Intel yakomeje gukorana na Ayar Labs kugira ngo bashakishe uburyo bwo guhuza ibimenyetso bya bandwidth bihuriweho, bitegura inzira yo gukora ibikoresho byinshi bya optoelectronic co-packaging na optical interconnect.
Nubwo modules zishobora gucomekwaho zikiri amahitamo ya mbere, kunoza imikorere myiza y’ingufu CPO ishobora kuzana byakuruye inganda nyinshi. Nk’uko LightCounting ibitangaza, kohereza CPO bizatangira kwiyongera cyane kuva kuri ports za 800G na 1.6T, buhoro buhoro bitangira kugurishwa kuva mu 2024 kugeza 2025, kandi bibe umubare munini kuva mu 2026 kugeza 2027. Muri icyo gihe, CIR yiteze ko inyungu ku isoko ituruka ku gupakira ibikoresho by’amashanyarazi bizagera kuri miliyari 5.4 z’amadolari mu 2027.

Mu ntangiriro z'uyu mwaka, TSMC yatangaje ko izafatanya na Broadcom, Nvidia n'abandi bakiriya banini guteza imbere ikoranabuhanga rya silicon photonics, CPO y'ibikoresho bihuriweho byo gupakira n'ibindi bicuruzwa bishya, ikoranabuhanga ryo gutunganya kuva kuri 45nm kugeza kuri 7nm, kandi yavuze ko igice cya kabiri cyihuse cy'umwaka utaha cyatangiye kugera ku rwego runini, nko mu 2025 kugira ngo kigere ku rwego rw'ubwinshi.
Nk’ishami ry’ikoranabuhanga rihuza ibikoresho byo gufotora, imiyoboro ihuriweho, gupakira, gushushanya no kwigana, ikoranabuhanga rya CPO rigaragaza impinduka zazanywe no guhuza optoelectronic, kandi impinduka zazanywe no kohereza amakuru nta gushidikanya ko ari mbi. Nubwo ikoreshwa rya CPO rishobora kugaragara gusa mu bigo binini by’amakuru igihe kirekire, hamwe no kwiyongera kw’ingufu nyinshi za mudasobwa n’ibikenewe byinshi byo gupima umuvuduko w’amakuru, ikoranabuhanga rya CPO photoelectric co-seal ryabaye urugamba rushya.
Bigaragara ko abakora muri CPO muri rusange bizera ko 2025 izaba urufunguzo rw'ingenzi, ari narwo rushobora guhindurwamo 102.4Tbps, kandi ko ibibi bya modules zishobora gucomekwaho bizarushaho kwiyongera. Nubwo porogaramu za CPO zishobora kuza buhoro buhoro, gukoresha opto-electronic co-packaging nta gushidikanya ko ari bwo buryo bwonyine bwo kugera ku muvuduko mwinshi, bandwidth nyinshi n'imbaraga nke.